Advanced Substrates Improve I/O Density and Power 10,000 Advanced flip-chip substrates 1,000 Flip-chip substrates 2 2 m >1,000 I/O/mm m <0.1 pJ/bit r 100 e Wire bond substrates 2 I/O p 100-500 I/O/mm >1 pJ/bit 10 2 1-10 I/O/mm >10 pJ/bit 1 1000 100 10 1 Line/space pitch (µm)
New Ways to Wire and Integrate Chips Page 45 Page 47