Announced Backside Power Distribution Network Approaches Buried Power Rail Power Via Backside Contact to S/D Power Backside Buried n-TSV via power rail contact Power delivery Area Scaling Good Better Best Process Complexity Low Medium High Source: Adapted from Song et al (IEDM, 2021) Source: Adapted from public company disclosures (2021) Source: Adapted from Song et al (IEDM, 2021) with subsequent analysis by Applied Materials with subsequent analysis by Applied Materials with subsequent analysis by Applied Materials
New Ways to Wire and Integrate Chips Page 31 Page 33