The New Playbook ENABLED BY KEY INFLECTIONS  New ASICs and accelerators New architectures  New memory / in-memory compute  Specialty, CIS, power  GAA transistors New structures / 3D  Backside power distribution  3D NAND, 3D DRAM  Gate New materials  Contact  Interconnect  EUV enablement New ways to shrink  Materials-enabled patterning  3D patterning control  High-bandwidth memory Advanced packaging  2.5D silicon interposer  3D TSV, hybrid bonding