System Integration with Emerging 2D and 3D Interconnects Through-Silicon Vias (TSV) Hybrid bonding Chip 1 Source: TechInsights (Chipworks) IMX260 Chip 2 Camera Module Report, 2016 Micro-bump Polymer RDL Flip-chip bump Advanced substrate Polymer RDL/ Si interposer Image Sources: SystemPlus Consulting Reports  Advanced substrates package chips side-by-side with higher bandwidth (more I/Os) and lower power  TSVs with micro-bumps or hybrid bonding create vertical interconnects allowing chip-on-chip stacking