Panel-Level eBeam Metrology and Test Defect review with SEM and FIB analysis Non-destructive eBeamtest Protrusion Residuals Normal interconnect Shorts highlighted  Automatic defect review  Fault detection by voltage contrast  Precise CD measurement  High-throughput analysis  In-situ failure analysis  Damage-free eBeam: Electron beam SEM: Scanning electron microscope FIB: Focused ion beam