Hybrid Bonding for High-Density Chip-to-Chip Interconnects Hybrid bonding Approaches Wafer-to-wafer Die-to-wafer Dielectric materials and copper pads fuse 2  Enables >10,000 connections per mm  Requires precision in processing and alignment  SoC performance can be reconstituted and Multiple hybrid bonding options expanded with hybrid bonded chiplets SoC: System on a chip